Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef
Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu
Electronics Forum | Fri Sep 02 07:38:13 EDT 2005 | DannyJ
Hi Mike, I haven't tried the 0201s with a Hyrda, but after seeing 20 reviews of your message without a response, I'll try and share my experience with 0402s on a non-Hydra machine. The 0402s are slow, but I managed to get some speed by maxing out
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Thu Jul 03 08:53:27 EDT 2008 | rgduval
I would...and then use the data of the known issues as part of the secondary analysis. The defect is a defect, one way or the other. You can use the secondary analysis of your PPM numbers to continue to drill down in the process. If your overall P
Electronics Forum | Wed Jun 09 02:35:10 EDT 2004 | Bernard
Base on the PORON foam rubber recommended, is it possible to apply on small BGA chip of 4x4 ball size 0.3mm. Any specific part no and supplier for this type of foam and is it a anti-static material? Would it be possible to punch out at dia. 3mm?
Electronics Forum | Sat Sep 23 21:52:51 EDT 2017 | jlawson
In most cases PnP files are all that is needed for SMT program generation. BUT, it depends on origin reference of this data as exported to PnP and could be off in X,Y and rotation of image pending when PnP Data is exported. Also Rotation of parts
Electronics Forum | Tue Aug 31 12:01:26 EDT 2004 | russ
Kris, this practice has gone on for years. I have never heard of any problems associated with this. I have heard "grumblings" about tin lead parts being processed with lead free paste, but have seen or heard of no data to support. Russ
