Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Industry News | 2009-03-20 17:14:54.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Young Jin's line of conveyors in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2012-01-30 13:43:45.0
Seika Machinery will highlight many new, innovative products at the upcoming SMTA Dallas Expo and Tech Forum.
Industry News | 2012-05-31 21:23:25.0
Seika Machinery, Inc. will display its new and innovative products at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2012-11-29 13:51:39.0
Seika Machinery, Inc announces that Senior Sales Manager Michelle Ogihara will be available to discuss the company’s new, innovative products at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place on Tuesday, December 4, 2012 from 10 a.m.-5 p.m. at the Fiesta Resort Inn and Conference Center in Tempe, AZ.
Industry News | 2013-01-16 13:59:39.0
Seika Machinery, Inc., will showcase its proven, advanced machinery in booth #2727 at the upcoming IPC APEX EXPO
Industry News | 2018-01-24 20:59:22.0
Seika Machinery today announced plans to exhibit in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. Seika will showcase a complete lineup of leading-edge equipment, including the latest models from McDry, Sawa, Sayaka, HIOKI and MALCOM.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.