Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
Electronics Forum | Mon Mar 02 11:27:51 EST 2009 | wrongway
Check stencil is their a lot of paste still on the stencil if so that is the extra thickness maybe add more pressure. check to see if board is coming up far enough to touch the bottom of the stencil.
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Mar 06 12:38:34 EST 2009 | mgershenson
Is this a manual measurement machine? As already stated, knowing the height of the pad underneath the paste brick is critical to knowing the true height an/or volume of paste. Any decent automated inspection system will have a way to factor out the p
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Tue May 20 12:20:18 EDT 2008 | danimalz
Does anyone have an easy way to estimate how much solder paste is applied to a smt pcb? I understand it varies on squeegee pressure, stencil thickness, and pitch of the components but I was looking for an average. I would assume that somewhere out th
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri May 11 10:33:22 EDT 2001 | wbu
Hi KP, I�m wondering why you send those boards outhouse for the SMD part with a stencil. How do you know it fits their printer. We give the stencil data 1:1 to the subcon so that they can order the stencil to their needs with reduction and thicknes
