Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Fri Dec 06 18:13:15 EST 2002 | slthomas
We only have solder balling problems in the interface of the pcb with the selective soldering pallet. All other boards (single, and double sided glue and waved alike) are fine, so I'm not thinking this is going to follow the normal path for resoluti
Electronics Forum | Fri Jan 29 11:23:54 EST 2010 | ppwlee
Smtnet, I am looking at pros and cons for automated soldering. The application is a simple multi pin through-hole soldering on a high volume manual assembly line. The goal was to eliminate defects associated with missing solder pins which goes undet
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Dec 02 17:02:28 EST 2002 | Vince Whipple
Steve, I agree with the recommendation to check the temperature. This is the first place to go. Is this an IPA or water based Noclean? What is the topside temp of the assembly at the effected areas? If you are too cold you will have a tendency to hav
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
