Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Fri Oct 02 16:04:47 EDT 1998 | Benji Acosta
Hi Dave, Thanks for your response. HAST is an acronym for Highly Accelerated Stress Testing. Instead of the conventional PCT or Autoclave which requires say 168 hours, HAST can tremendously shorten the time. There has been correlation being estab
Electronics Forum | Wed Jan 02 17:18:01 EST 2002 | Carol Stirling
Hello All, Hope you had great holidays and are all rested up for 2002! I would like some feedback on various optical inspection equipment for PBGA that different companies have used - the drawbacks to look out for, certain features that can be reco
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Sat Mar 01 08:17:40 EST 2003 | davef
You're correct that the FR4 is probably the best choise. The majority of the problems in developing your reflow recipe is going to come from the CTE mismatches in the CCBGA , CBGA and PBGA that you put on the board. The other side says given the pr
Electronics Forum | Tue Mar 09 22:20:16 EST 2004 | Ken
Is this a PBGA? If yes. run a flat steel rule or edge across the top of the PBGA. Is it flat or cupped? Is this a TBGA (super bga). I have seen issues with a suppliers heat spreader design that actually will deflect the corners down and raise the
Electronics Forum | Wed Mar 10 04:52:11 EST 2004 | Gabriele
Hi As I know PBGA reballing is not recommended or better not allowed by all the most important Standards. Exceptionally Cstly Ceramic BGA or Ceramic ColumnGA where you can perform electrical test before reballing (90/10 ball/column-balls made) some
Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
