Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm
It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen
Electronics Forum | Tue May 06 06:29:06 EDT 2003 | yukim
Hi, No, the layout is different, but both have chips located arallel and perpendicularly to the flow direction. And we do have defects in both orientation. What about the PCB warpage? Sometimes we find warped PCBs. Could this affect? Thanks, Yu.
Electronics Forum | Fri Nov 08 14:45:12 EST 2019 | charliedci
Appreciate the input from everyone. The PCB is .062" thick. As a CM we are at the mercy of our customer at this point although (hopefully) they are receptive to advice on the next build. Titanium strips could be an option, I also thought there might
Electronics Forum | Fri Oct 12 15:52:41 EDT 2007 | etienne
Hope that your PCB is supported evenly, I mean really plane to the conveyer rail. If not this may warp the PCB upwards, causing fiducials to be identified not accurately. Also I suggest you to check Mark Info of the fiducials and have a look at the t
Electronics Forum | Tue Jun 29 14:44:26 EDT 2010 | rgduval
There are some good suggestions here...reflow pallets, and copper balancing. We would also suggest verifying that your problem is not caused by moisture. How much time passed between first side and second side reflow, and how humid is the environme
Electronics Forum | Thu Apr 14 12:33:30 EDT 2005 | russ
Have you checked the component height in the package data to ensure that it is the same? how about the PCB itself, could there be some warp or twist thay may cause the component to be dropped onto the board? any support problems? this is all I can
Electronics Forum | Wed Sep 29 03:41:32 EDT 1999 | Wolfgang Busko
| Hi All, | Any one experince BGA-chipset warp about 10-15mil after removing | from PCB? | FYI, the rework temperature for preheat was 170C from room | temperature about 30 seconds, & BGA was removed at temperature | between 190-200C. | Thankyou.
Electronics Forum | Wed Sep 29 22:50:57 EDT 1999 | Dave F
| Hi All, | Any one experince BGA-chipset warp about 10-15mil after removing | from PCB? | FYI, the rework temperature for preheat was 170C from room | temperature about 30 seconds, & BGA was removed at temperature | between 190-200C. | Thankyou.
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
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