Electronics Forum | Wed Jul 06 04:27:30 EDT 2005 | aj
Javi, If the components are caps and resistors etc there should not be much problems. I would say everyone at this stage has a mixture of leadfree and lead components. The problem really starts when you are running the likes of Leadfree BGA where th
Electronics Forum | Wed Jul 27 22:14:57 EDT 2005 | Ken
If no-clean...then this seems "relatively" normal. You could try and extend your peak and duration, however, manufacturers are adjusting their chemistry to survive these normal temperatures (up to 260C and 30 seconds within 5C of peak). You will h
Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds
MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Thu Oct 19 08:54:39 EDT 2006 | df
thanks for replies guys. I have a nearly Full RoHS Compliant bom with 1 device non-rohs. It is a soj28 device rated ( as best as I can find out at 225degC) Production are screaming for these boards - I put a thermocouple on the part and it hits 23
Electronics Forum | Wed May 28 08:46:39 EDT 2008 | ck_the_flip
I've talked to several Applications Engineers and Chemists from a couple of different paste manufacturers and they confirm that the profiles on their data sheets are nothing but guidelines. It's up to you, Process Engineer or Process Tech, to develo
Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork
I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23
Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Tue May 19 14:54:47 EDT 2009 | c111
Do you have any OEM's or CM's or a local college that may have the equipment? could you hire them to come in and profile. SR Tech is correct you shouldn't poke and hope with profiles! Sounds like you are not hitting peak temps. if the above are not a
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
