Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas
Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Jan 17 16:43:03 EST 2006 | davef
If you are not washing and want to stay with a peelable mask the two basic types are vinyl and latex. Although we've seen some silicone and urethanes, they cost more. * Do not use latex peelable solder mask with a low residue soldeing process withou
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Tue Jul 15 10:44:49 EDT 2003 | MA/NY DDave
Hi, Although I grit my teeth it does sound like a normal process engineer or engineering situation. Here you are with knowledge and ways to get knowledge of best practices and No One listens. ----- Now I have a cleanliness testing joke (real sto
Electronics Forum | Fri Apr 10 07:52:16 EDT 2009 | davef
On cure checking, we have this undated note from Jack Crawford at IPC * IPC-SM-840C "Qualification and Performance of Permanent Solder Mask" has several Test Methods for different types of solder resist material, but probably the only applicable one
Electronics Forum | Wed Jan 28 08:11:20 EST 2004 | stefwitt
Martin, may I ask what your offer is? Does the pick and place machine vendor provide you with a special nozzle, which would not require the peel off cover. Custom nozzles from the OEM are quite expensive, because they implement engineering and test.
Electronics Forum | Fri Dec 16 10:25:14 EST 2005 | GS
Hi Liza - polystirene monolayer (blend ?) could be sealed at less presure, ie 35-40 PSI. Temprature could be 165�-170�C. For sure after sealed you shoud make sure the sealing strength (peel strength)should meet min 15-25 N.(bet avg from 25 to 45 N)
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
