Electronics Forum | Mon Oct 12 13:28:56 EDT 2009 | swag
When you teach the fid on the PCB and the camera then changes to stencil image, is it in close physical proximity to the feature/fid you wanted or do you have to move quite a bit?
Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL
Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris
Electronics Forum | Mon Jun 13 10:20:28 EDT 2011 | davef
We agree with ScottE. Search the fine SMTnet Archives for background discussions. For further discussion on the "being hosed by the physics": http://www.cooksonsemi.com/tech_art/pdfs/Controlling%20Warpage.pdf
Electronics Forum | Mon May 21 08:51:14 EDT 2012 | fredc
We have been seeing this in the nozzles we have made. We will building all new LED nozzles out of teflon where physically possible. Many of the new Cree LED recomendations are for teflon nozzles. In some that teflon was not recomended teflon was the
Electronics Forum | Mon Aug 06 16:47:41 EDT 2012 | duchoang
Can you give more info: - Hand-soldered? Placed by Pick&Place machine? What kind of SMT machine? - Oven re-flowed? Temperature? - Any physical impact?
Electronics Forum | Thu Feb 14 23:08:41 EST 2013 | dekhead
Squeegee error on a 248 is strictly that sensor (reed SW) on corresponding (Front / rear) squeegee cylinder is not seeing a change in state... Either a physical obstruction preventing cylinder from exending fully - OR- if it is extending fully, then
Electronics Forum | Fri Aug 12 08:52:29 EDT 2016 | sarason
In short physics. A large Black object will absorb more energy than a smaller non-black object. Thus the temperature will remain lower around the black object as it heats up ! sarason
Electronics Forum | Tue Mar 07 06:23:56 EST 2017 | rob
Hi Westen, Yes, lots of things cause problems on an physical PCB compared to a simulated PCB. Noise, special laminates, harmonics etc. This is a good starting point: http://www.ti.com/lit/ml/slyp173/slyp173.pdf Rob.
Electronics Forum | Thu Oct 05 13:33:28 EDT 2017 | duchoang
We did some tests with good result. No failure physically and functionally. Is there report/study/documents about this procedure so we can convince customer to approve our process using ultrasonic wash. Thank you, Dave
Electronics Forum | Thu Nov 08 08:05:15 EST 2018 | bukas
there are few physical differences, sw is same. and for me the biggest one is that CP45FV has springs on its spindels, while CP45FV NEO has springs on nozzles.
