Electronics Forum | Fri Feb 11 08:44:26 EST 2005 | pemnut
We use these machines to insert swedge pins. When I first started here, there were certian programs that we ran that required us to put in a machine offset of +.120 in the X which is a lot. after learning the machines better, I realized that whoever
Electronics Forum | Fri Feb 03 11:13:05 EST 2006 | cyber_wolf
Daxman, The noise you are hearing is a worn out coupling on your large C-axis motor. The pins get loose after a while and they make noise. We had the EXACT same problem. Your station 17 and 19 errors are most likely from dirty windmill sensor dogs
Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple
I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Wed Jun 16 07:46:45 EDT 1999 | Glynn Technologies and Manufacturing
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Wed Sep 01 14:47:42 EDT 2010 | rway
***Correction*** I stated, "1-2mm is pretty small (that's roughly 4-8mil). You might consider making your fids larger, perhaps 7-10mm (30-40mil)." My conversion was incorrect. I was brash in thinking I could do it by hand. Sanchu 70 is right, 1mm
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Thu Jun 28 20:11:32 EDT 2007 | rfrog
Hi folks, I've been bouncing off of MyData technical support for some time on an issue with a MyData machine. Seems that this My9 likes to skip an 0402 placement at a rate of ~ 1000/million. Profile: MyData My9 Mechanical centering Midas only
Electronics Forum | Tue Jul 10 16:13:52 EDT 2007 | bk
Hi folks, I've been bouncing off of MyData > technical support for some time on an issue with > a MyData machine. Seems that this My9 likes to > skip an 0402 placement at a rate of ~ > 1000/million. > > Profile: MyData > My9 Mechanical ce
