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YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

New Equipment | Materials

                         YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA (Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill.

YINCAE Advanced Materials, LLC.

IONOX® I3955 - Vapor Cleaning Solvent for Electronics

IONOX® I3955 - Vapor Cleaning Solvent for Electronics

New Equipment | Cleaning Agents

IONOX® I3955 is a precision vapor cleaning solvent designed as a drop in replacement for modern era vapor degreasing equipment. IONOX® I3955 is effective in removing no clean and rosin flux residues from electronic assemblies including low stand-off

KYZEN Corporation

SMT PCBA Offline Cleaning Machine SME-5600

SMT PCBA Offline Cleaning Machine SME-5600

New Equipment | Cleaning Equipment

SMT PCBA Offline Cleaning Machine SME-5600 Cleaning basket size L610 x W560 x H100 (mm) x2 layers Spray tank capacity 17L Clean time 5~20min Machine weight 460KG Product description: SMT PCBA Offline Cleaning Machine SME-5600, leaning basket s

qismt electronic co.,ltd

PCBA CLEANING MACHINE 5600

PCBA CLEANING MACHINE 5600

New Equipment | Cleaning Equipment

PCBA CLEANING MACHINE 5600 Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: PCBA CLEANING MACHINE 5600, Demensions:600 x 1000 x 1600mm, PCB width:50-400mm, PCB Length:Max 460mm, Pit

qismt electronic co.,ltd

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Technical Library | 2017-08-17 12:23:27.0

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.

Indium Corporation

100g Solder Paste for BGA refwork mobile phone repare

100g Solder Paste for BGA refwork mobile phone repare

New Equipment | Other

100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &

Flasonsmt Co.,ltd

100g Solder Paste for BGA refwork mobile phone repare

100g Solder Paste for BGA refwork mobile phone repare

New Equipment | Other

100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &

Flasonsmt Co.,ltd

SMT PCBA In-line Cleaning Machine SME-6200

SMT PCBA In-line Cleaning Machine SME-6200

New Equipment | Cleaning Equipment

SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~1

qismt electronic co.,ltd

Conformal Coating over No Clean Flux Residues

Technical Library | 2015-03-04 10:56:26.0

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues.

AIM Solder

Alpha Solder Paste

Alpha Solder Paste

New Equipment | Solder Materials

Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f

Stellar Technical Products


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