Electronics Forum | Mon Oct 10 17:47:10 EDT 2005 | jhagve
hi We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Tue Oct 11 10:49:14 EDT 2005 | jhagve
HI We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Fri Oct 14 07:56:32 EDT 2005 | davef
On understencil cleaning: * It's a good idea to do this to reduce printing defects, as you say. * We clean dry. * Our cleaning frequency varies acording to product, maybe ranging from 10 to 20 prints, averaging around 12 to 15. * As long as cleaning
Electronics Forum | Tue Apr 27 08:13:28 EDT 1999 | wayne sanita
i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks
Electronics Forum | Tue Feb 02 09:01:34 EST 2021 | denism
The main feature of the step on the stencil is the excess of paste on adjacent components. Clearance between step and fine pitch components must be at least 10 mm. Might better try over printing?
Electronics Forum | Wed Oct 05 13:54:07 EDT 2011 | jillatchoice
I have a ProPen P3000 for marking metals and plastics. Please email if interested.
Electronics Forum | Fri Nov 01 00:12:16 EST 2002 | Darby
Ive always preferred "Put another log on the fire" for those emotional moments. Why don't you tell a couple of these purveyors of print that you haven't got a clue. See who is the most helpful in giving you some time and knowledge so that you then ha
Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev
For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
Electronics Forum | Tue Mar 13 09:17:08 EDT 2012 | davef
Hard plastic, such as polyurethane or Teflon, are fine for printing adhesives, since there isn't as much as a requirement for applying sheer as there is with paste. So, scooping is not as much of a issue.
