Electronics Forum | Fri Aug 04 11:04:27 EDT 2000 | John
We manufacture a mixed technology board, that uses a through hole "mini cap" with a 2.5 mm lead span. We have had several failures caused by solder wicking up through the plated through hole pcb and touching the can. This shorts out the capacitor.
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Tue Nov 27 13:36:22 EST 2001 | jmathis
Solder balls on the topside of our wave solder boards is a real issue. We have found that during the wave solder process, solder will enter through the via holes in the form of solder balls. It seems to be related to flux captured in the vias and o
Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin
HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How
Electronics Forum | Wed Mar 01 09:34:13 EST 2000 | Sorin
HELLO, Do anybody know if is existing an empirical rule that can show me how many amps can carry a plated through hole with a diameter of x.xx millimeters? Is there a formula depending on X.XX value that could help me to make such calculations? How
Electronics Forum | Mon Jun 25 10:35:39 EDT 2001 | rkevin
Despite all my efforts I cannot eliminate icycling on my t/h leads. They come and go.... daily, lots of rework. I have eliminated the following from the scenrio: Inadequate flux to promote quick drainage, Pot temperature too low, Soldering surface
Electronics Forum | Thu Jul 05 06:36:14 EDT 2001 | nifhail
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Thu Jul 05 06:38:35 EDT 2001 | Danial
Thanx Dave, I agree with you on the planning part...yapp!! the same guy who've thrown an old datecode components to me..now they did it again on the PCB. Well Dave, could you explain a little bit more about the "hi-test flux" that you mentioned ab
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Wed Mar 10 15:09:34 EST 2004 | Jay
You can say "re-flow". It's related with the process. In order to assemble a PC Board containing lots of components such as PTH (Plated Through Hole) and SMT, usually, PTH type packages and components are soldered first using wave soldering process.
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