Electronics Forum | Mon Mar 05 18:56:47 EST 2001 | davef
Stefan: Thanks for the clarification on the Siemens machine operation. Yes Stefan, Germany and some other countries have wonderful apprentice programs. Generally, we Americans have the patience of a staving gerbil for such things. Is the ON butto
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Tue Apr 07 05:41:34 EDT 1998 | Bob Willis
Based on work I have been doing recently the most common reasons for component loss is board flexture and vibration on the reflow process. If parts do not reflow then weight is not an issue. There is a video on double sided reflow and PIHR from the S
Electronics Forum | Mon Mar 10 15:52:26 EST 2003 | eagle-eyed-one
Hello Neil, I absolutely agree with the conclusion of limits as you have stated. There are 2 sets of limits in which machines can be measured against for compliant performance. First and most critical being the quality performance specification limit
Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus
Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your
Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Mon Sep 13 16:29:17 EDT 1999 | Earl Moon
| | Dearest Jennifer, | | | | Ooooops! Forgot which one I was writing - please forgive me. Ah yes, SMT and you, you see even we don't get it right. If you combined all our answers, you would get close - as close as when we get frustrated. | | | | A
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se