Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Wed May 26 10:00:03 EDT 1999 | David Scott
| | | | | | | | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcoh
Electronics Forum | Sat Feb 22 11:37:00 EST 2020 | kylehunter
Hey all, I've made a post in the past about us expanding to a new space, but I wanted to do a new post with specific questions. We currently have a DEK 265, Phillips Opal Xii, and a Heller 1500. Our main reason for expanding is to have a lead-free
Electronics Forum | Tue Dec 08 12:44:52 EST 2020 | janwillemreusink
Who is using two sorts of tin in one selective soldering machine with to solder pots? So then the soldering program selects the correct pot (tin). What are the risks? Adding wrong tin in the wrong pot. Mixing up the nozzles?
Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
Electronics Forum | Thu Dec 10 12:12:40 EST 2020 | robl
Yep, done it previously with a multipot machine. Using with wirefeed to top up the pots means you only have a contamintion risk when you fit a new top up reel. Used separate nozzles for both, but theoretically using titanium nozzles would mean no c
Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
