Electronics Forum: pre-baking (Page 6 of 7)

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Re: Plastic BGA

Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc

Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity

Poor soldering on fine pitch?

Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike

We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th

RoHS Board Delamination

Electronics Forum | Tue Oct 24 09:52:35 EDT 2006 | SWAG

We are having the exact same problem! We do about 6 or so ROHS SMT builds. 5 are fine now but we had problems with most initially and 1 is trouble still. All boards are same material, same PCB manufacturer. Initially, when the delam. problem occu

Rigid Flex Wave Soldering

Electronics Forum | Wed Apr 04 14:29:16 EDT 2007 | rgduval

Anyone have experience wave soldering rigid flex assemblies? I've just picked up a new job from a customer; it's a rebuild for the company, but new to me. The customer had previously taken their business elsewhere due to delamination problems with

PCB Baking after Wash

Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55

Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D

Delamination / Measling

Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse

Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co

MSL Component - Popcorn Temp.

Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman

Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS

Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F

| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne


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