Electronics Forum | Tue Apr 16 11:13:22 EDT 2002 | gzweig
In response to questions on BGA Process Requirements and X-ray Inspection please request pdf publication : "Rapid and Effective X-ray Inspection of BGA using Siganture Identification" from : gzweig@glenbrooktech.com
Electronics Forum | Tue Apr 16 14:40:06 EDT 2002 | jborrelli
We're currently brining up the BGA process. In instances where we needed to place a BGA for proto run, we subcontracted bga placement to a local organization, but its spendy. Would not want to use for production. We also intend to use an mpav.
Electronics Forum | Wed Apr 17 22:43:54 EDT 2002 | ianchan
what process is that? can kindly describe? is it that technology where bricks of solder are "ready made" deposit onto PCB pads thus eliminating the need to solder paste print/dispense by machine?
Electronics Forum | Thu Apr 18 20:01:28 EDT 2002 | francis khoo
Hello Industry Friends, Can anyone provide me with a guideline to compactflash memory processing requirements please. Regards, Francis Khoo.
Electronics Forum | Fri Apr 19 23:02:38 EDT 2002 | francis khoo
Hello Dave, Thanks for you input. The website suggested to look into is exactly what I was looking for. I am very happy. Apart from the SMT portion of the process, I was looking at the plastic assembly as well. Do you know if the plastics are welded
Electronics Forum | Mon Apr 22 19:56:28 EDT 2002 | francis khoo
Hello Pete, Thanks for your insight. I understand and appreciate the NDA situation. I now have a good understanding of the process requirements thanks to you and Dave. Take care and keep in touch. Warm Regards, Francis Khoo.
Electronics Forum | Mon Aug 29 07:29:54 EDT 2005 | javi
Patrick, See your point. I migth was too focused towards how our EMS could get control of the mixed SMT process and final qualification. Rgds JaVi
Electronics Forum | Wed Jan 23 13:48:06 EST 2008 | flipit
You can do a destructive test to sort of check your process. Break off the flipchip and look for voids. I have used Namics 8437-2 for the last 7 or 8 years. Good stuff. Flows under a 0.001" gap with no voids. Chris
Electronics Forum | Wed Sep 03 16:52:22 EDT 2008 | phongng_99
Hi, Do we need to bake the board before doing the BGA replacement (not reball process). Thanks Phong Nguyen
Electronics Forum | Wed Apr 22 15:50:24 EDT 2009 | emilioescatel
Hi: I would like to know their opinion about the critical variables that I need to control in a screenprinter(solder paste aplication on PCBs) process and how I can control them. Thanks.
