Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
Electronics Forum | Tue Jan 30 17:36:59 EST 2001 | slthomas
Looking for recommendations for references on quality an process control.....SPC, process capability (cp, cpk), etc. My feet are a little wet on this stuff, but we'll be implementing soon so I'll need a reference to bail me out on occasion. You kn
Electronics Forum | Wed Aug 20 18:17:56 EDT 2003 | stefwitt
I guess we should differentiate between machine calibration, process reliability measurements and process capability study. For the machine calibration you use the machines own optical cameras, but for cpk or standard deviation you measure the place
Electronics Forum | Tue Sep 26 20:14:29 EDT 2000 | Dave F
I agree with Wolfgang that a check list, like he proposes, is very useful in evaluating your ability to assemble products. No sense designing a 16 inch board if the throat of your wave is 15 inches. Taking a different tact � what if you define your
Electronics Forum | Tue Sep 26 20:16:07 EDT 2000 | Dave F
I agree with Wolfgang that a check list, like he proposes, is very useful in evaluating your ability to assemble products. No sense designing a 16 inch board if the throat of your wave is 15 inches. Taking a different tact � what if you define your
Electronics Forum | Fri Feb 11 05:32:31 EST 2000 | Dean
Your customers design and your process capability would determin this (W/S vs. noclean). EX. Can you clean adequately for low stand off components? I have some BGA products which operate at 20GHz (atenuation and cross-talk is off the charts. )No wa
Electronics Forum | Tue Dec 21 16:47:15 EST 1999 | GERARDIN
Hello Pascal As mentioned by Wolfgang the key issue is the printing process capability. For a thick copper level 90�m we noticed that the pad reduction can be greater than 20% depending on supplier sources. Typicaly for a cad Width = 0.4 we can
Electronics Forum | Wed Mar 18 13:25:55 EST 1998 | Earl Moon
| Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | Mike Yes and often. People
Electronics Forum | Wed Jun 26 08:53:32 EDT 2002 | davef
We have not done a DOE on board warping. Consider: * How close the board gets to its Tg during the reflow cycle * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * Time at temperature
Electronics Forum | Fri Feb 28 09:08:03 EST 2003 | davef
Without drilling through the numbers, they're probably correct. Recognize that standard warp / twist specs [IPC-A-610 1.5% for PTH only and 0.75% for SMT] are not going to make it on tech boards. You need to define specific requirements. This warp
