Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Fri Jun 03 09:00:06 EDT 2005 | russ
How many times have you found that your oven was performing differently? this will give you the answer on frequency. We have a dedicated board and profile that we use to verify the oven operation. We perform this every 3 mos. and I believe that th
Electronics Forum | Thu Apr 11 11:26:34 EDT 2002 | johnw
Dave, I sand corrected since I know you wouldn't steer me wrong...although the lst time I looked at the IPC spec for a solder profiel it was still designed for older generations of paste and were specifically water wash biased although that doesn't c
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Tue Aug 24 11:44:50 EDT 2004 | Dreamsniper
The best is, create 2 different profiles for each PCB type. Then segregate or separate them and do not let them run together in one line. Switch to the proper profile settings each time you change to other PCB type. This is the best. Each PCB materia
Electronics Forum | Tue Apr 07 09:02:00 EDT 2020 | proy
I am removing a few QFP100s with a Pace rework station. Most of my profiles stored are set up with preheat/soak/spike which is more geared to the replacement resoldering. I am looking for suggestions on what people use for a quick/safe removal ie: no
Electronics Forum | Wed Mar 21 20:02:37 EDT 2012 | hegemon
Lead Free in 5 zones is tough sledding. Start with your manufacturers solder reflow profile and calculate your belt speed by looking at the recommended heating time for the solder paste vs. the length of your heated zones. Set your belt speed so tha
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Fri Apr 10 03:52:13 EDT 1998 | Frank J. de Klein
I would like to invite everyone to share/discuss information/knowledge/experience they have with the req's that are assumed to be valid for the temperature/time relation in the process of reflow soldering Pin In Paste, Intrusive Reflow or whatever yo
