Electronics Forum | Wed Sep 03 19:54:23 EDT 2008 | vladig
Well, I'm not a sale person whatsoever. I'm a purely technical guy (even PhD :-)) who has been with the industry for quite a few years and I know very well what intermetallics means and how thck it should be for different board finishes and solders
Electronics Forum | Mon Aug 24 11:17:19 EDT 2009 | stepheniii
Don't make that assumption. Once we had concerns about PCB's not matching what was ordered. I said "if we got HASL instead of ENIG, how do we know we got lead-free?" I mean if one thing got mixed up in translation, maybe two did. So we put a bare P
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN
I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t
Electronics Forum | Wed Dec 15 16:38:42 EST 2004 | patrickbruneel
Here's my 10 cents Studies done in the 1980's concluded that pure tin was prone to whisker generation. A tin content lower then 70% became exempt from this phenomenon. I have never seen or done any studies on the impact lead had in reducing the pote
Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com
Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Fri Mar 24 11:12:06 EST 2006 | patrickbruneel
You�re a good man Rob and a good patriot, you defend your governments decisions even if they're wrong. Isn't the WEEE directive aimed at preventing electronics ending up in a landfill? This immediately takes away the leaching arguments and is a great
Electronics Forum | Sat Oct 09 03:26:58 EDT 1999 | Brian
| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | Dross is a mixture of various things. The obvious ones are met
