Electronics Forum | Thu May 31 21:43:44 EDT 2012 | davef
edmaya33, you're correct about what J-STD-001E says, but recognize that the measure that you refer us to in not IC [Ion Chromatography]. It is modified ROSE [Resistivity of Solvent Extract] ... or whatever they call modified ROSE now-a-days
Electronics Forum | Mon Dec 03 15:46:16 EST 2012 | bmario
Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?
Electronics Forum | Tue Jan 31 09:10:04 EST 2017 | Rob
Hi Joshua, We've done both, but a lot depends on what soloution your machine vendor has, and how good it is. Can you add it into your machine acceptance criteria? Rob.
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F
Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Wed Mar 03 14:16:59 EST 2010 | davef
First, we expect that your equipment supplier would help you with this. Then again with lots of used equipment flying around, some of the basic stuff often gets pushed to the back of the bus. Second, here is a clip and paste on the basics of equipm
Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
