Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-11-06 09:41:35.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Industry News | 2013-11-14 18:21:25.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2011-08-24 13:12:43.0
Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2015-01-15 21:53:14.0
Indium Corporation's Kenneth Thum, senior technical support engineer, and Nguyen Viet Truong, assistant technical manager for Asia Pacific operations, will present at the upcoming IPC Conferences on Assembly and Reliability in Vietnam and Thailand.
Industry News | 2022-01-10 16:39:30.0
Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
