Electronics Forum: reballing and problem (Page 6 of 65)

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t


Electronics Forum | Sat Jan 25 17:46:07 EST 2003 | testing

I am currently finding it challenging(help!) to determine how I can introduce SPC ontrol within the AOI process and how the AOI can help control other SMT processes. Can someone please provide me with some ideas or any of excels fancy charts/macro

0402's and Gluing.............

Electronics Forum | Wed Feb 16 16:41:31 EST 2005 | Mrduckmann2000

Pallets will not work in this case because the wonderful designers put 0402's between the legs and all around the legs of the thru-hole connectors. There are 18 thru-hole connectors on this board and 200 - 0402's around them. The 0603's that are al

Touch-up and Inspection Process

Electronics Forum | Tue Mar 01 13:51:23 EST 2005 | pjc

pr is 100% correct, can't have visual inspectors touching up for the reason he states. I have always seen that- when in doubt they will always "touch up". Touching up is always a bad thing. Looks like you have some problems that need fixing to elimin

SMT optimization and improvement

Electronics Forum | Sun May 28 23:01:31 EDT 2006 | jacksaria

Hello to all, We are encountered many problems/defects in SMT lines.I would like to know your suggestion or recommendation for SMT optimization and improvement. What are the step by step solutions in order to optimized and to improve the printer, pi

SMT optimization and improvement

Electronics Forum | Wed May 31 21:33:52 EDT 2006 | jacksaria

Hello jbrower, Thank you for the feedback. Actually, our main problems is the pick and throw. Whats your suggestion how to control the pick and throw?What are the factors that affecting pick and throw?How to reduce the sources of variance at each st

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu

Flexi boards and uBGA

Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG

Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w

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