Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp
I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.
Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Wed May 12 15:22:24 EDT 1999 | WDR
Earl you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? Thanks WDR
Electronics Forum | Tue Feb 26 10:42:48 EST 2002 | davef
Consider the hierarchy presented in http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18112
Electronics Forum | Thu Oct 25 20:15:23 EDT 2007 | wayne_
should have provide the link for all of you to look at it.... http://techon.nikkeibp.co.jp/article/HONSHI/20070926/139719/ to look at the real case study......:)
Electronics Forum | Fri Oct 26 11:09:13 EDT 2007 | hussman
Even a proper solder joint will fail if the rite stresses are applied to it. Sounds like you have an over heating issues, not a solder issue.
Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
