Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Wed Apr 25 14:41:13 EDT 2012 | davef
Try: Equipment, Sldr pallet hdware clips * Summit Precision 5825 S 25th St, Phoenix AZ 85040 Dennis Miller 602-268-3550 summitprecision.com sales@summitprecision.com * Southco 210 N. Brinton Lake Rd, Concordville, PA 19331-0116; 610-459-4000 southco
Electronics Forum | Fri May 04 16:22:21 EDT 2012 | wesm91229
Hi Tristian, I work at the 1st company listed- the link you posted is our website. We have updated our clamps for those type of SMT process carriers. Feel free to email me @ wmartin@gscusa.net or call 972-494-1911 and I can help you out. Sorry for
Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis
Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
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