Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Fri Aug 25 09:51:29 EDT 2000 | A. Marques
Hi, Somebody can tell me an good site of images of the reflow process. I need this to put in a document for formation. This images are: Chip defects (like tombstone, missing, solder bridge, etc..) Cic defects Best regards
Electronics Forum | Sun Mar 09 16:11:38 EST 2003 | Neil
I agree, with Dave what is your top 3 defects and what causes them? Most post reflow defect are already on the board before they go into the oven, all the oven does is expose them.
Electronics Forum | Wed Jun 10 11:21:04 EDT 1998 | Kelly Morris
Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. Example: Screen Print = 45% of total defects Component Placement = 25% of total defects
Electronics Forum | Sun Jan 22 04:57:25 EST 2017 | robertwillis
If you look at my book on Pin In Hole Reflow there are many examples of may process defects. Its free to download and the first book on the technology. if you send a photo of the defect I may be able to point you in the right direction see http://pih
Electronics Forum | Tue Aug 29 16:23:50 EDT 2000 | Murad Kurwa
The only source I know of is IPC-CD-A2; This CD contains clip arts that you can ues. Cost is $500. Call or emial to IPC. Good Luck Murad
Electronics Forum | Sat Jan 29 23:55:58 EST 2005 | KEN
I recently ran a process evaluation (Print/ P&P /Reflow) and was plesently surprised with a 5.0 sigma process or 250ppm. Attrition was under 1%. Keep in mind this is defects counted Post-reflow. The most signifficant defect was tombstoning / draw-
Electronics Forum | Mon Dec 06 09:28:11 EST 1999 | Dave F
Glen: So that's this metal? Is it in the area of PTH or SMT solder connections? Etc, Etc. Assuming its near connections where pasted is reflowed ... Reflow defects, bridging: misplaced components, high placement force mushrooms paste, too much p
Electronics Forum | Wed Jun 10 13:24:35 EDT 1998 | Justin Medernach
| Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | Example: | Screen Print = 45% of total defects | Component Placement = 25% of total defects |
Electronics Forum | Wed Jul 16 12:13:27 EDT 2014 | deanm
Thank you for your comments so far. I believe I threw some people off by my wording. Clarification: How feasible is it to run a board straight into the reflow oven without inspecting it first for any placement defects? Is nudging parts and performin
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