Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman
We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.
Electronics Forum | Mon Oct 08 22:25:19 EDT 2001 | caldon
See PeteC under the recent forum entry on "Reflow Ovens"....Pete is a true wealth of knowledge. I will try to post his info at a later date. Cal Manncorp
Electronics Forum | Thu Apr 18 21:34:35 EDT 2002 | davef
Nothing special. [Follow your paste supplier's recommendations for reflow.] SanDisk� NAND flash memory are sold as TSOP [thin small outline package] devices. Here�s what the innards of a card looks like: http://www.mittoni.com/information/insidecf
Electronics Forum | Tue Jun 02 21:13:08 EDT 2009 | kircchoffs
thanks for the inputs. we are planning to run on fuji nxt i think cycle time will not be an issue. i still have another question if we can still use the same reflow profile for paste? or do we need to create another profile?
Electronics Forum | Wed Jun 10 14:48:12 EDT 1998 | Chrys
| | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | Example: | | Screen Print = 45% of total defects | | Component Placement = 25% of total defects |
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Thu Mar 15 16:58:11 EST 2001 | mparker
The only way I know of waving the bottom side with SMT parts installed without epoxy would be to use a masking media, Kapton Tape, wave pallet that keeps those parts from being susceptible to gravity once the connections are reflowed. If there is ano
Electronics Forum | Thu Jun 26 10:02:06 EDT 2008 | rdnggbsss1
I am a PCB Designer and I have to put a note on the assembly drawing to tell the assembler how to clean the board. This is new to me. Here is a sample note. Can someone give me some feedback on it? "Use water washable, no clean solder paste for t
Electronics Forum | Wed Jun 10 13:24:35 EDT 1998 | Justin Medernach
| Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | Example: | Screen Print = 45% of total defects | Component Placement = 25% of total defects |
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
