Electronics Forum | Tue Aug 26 11:15:47 EDT 2003 | blnorman
We use HTN (high temperature nylon - Zytel) connectors in our reflow ovens with no warping, bubbling, or cracking. You can also use PPA (Amodel).
Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca
Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Tue Sep 02 22:03:03 EDT 2008 | davef
Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Fri Feb 01 10:57:52 EST 2002 | davef
Yes, that's what people are thinking. The 217�C melting temperature that you mention requires a ~250�C reflow temperature. Generally, boards, legend ink, and components cannot take that temperature. Further, few ovens can produce that temperature
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Mon Apr 15 06:30:23 EDT 2019 | spoiltforchoice
Its not the max temperature that is the issue, its how much energy the oven is capable of transferring to the PCB inside the 4-6 minute window of a typical profile. In a conveyor oven this is achieved by having zones of different temperatures, but th
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Tue Aug 26 09:30:56 EDT 2003 | Jim Z
Marc, There are many types of nylon used in the connector industry and some are designed to be used in high temperature (225-250C) oven reflow applications. These high temp nylons are usually types 4/6 and 6T. It sounds like you are either using a
