Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Fri Jul 09 18:36:48 EDT 2010 | rway
We don't use flex pcbs but have the same issue here. Most of our pcbs are HASL finish. I have looked at silver and gold immersion and both look really good under my color camera on my AOI. However, gold is more pricey. There is no additional cost
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Wed Apr 11 17:03:28 EDT 2001 | mparker
I've used Super Glue, with Kapton tape. The glue leaves a small residue and the tape acts as a strain relief. If you can sacrifice the board, drill a small hole through the board, push the exposed ends of the thermocouple up from the back side, lay
Electronics Forum | Tue Aug 24 15:15:43 EDT 1999 | John Thorup
| Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | Any help would be appreciated. Thanks. | Most common reason is uneven heating where one side of the component ach
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 10:07:46 EDT 1998 | J.H Kim
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE mismatches, no leads for stress relief,
Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
.gif)
