Electronics Forum | Wed Oct 29 22:41:42 EST 2003 | msimkin
Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remove the solder balls form the BGA before they are palced. ( std eutectic) Has anyone used a vendor to remove balls from BGA (0.75mm piutch, ball size ap
Electronics Forum | Wed Oct 29 23:40:29 EST 2003 | ppcbs
We here at Precision PCB Services, Inc. Perform selective ball removal. We just completed a job today where we removed 4 balls, and then installed traces to dog-bone the pads at two locations on 30 BGA's. An eaisier and more cost effective solutio
Electronics Forum | Wed Aug 17 16:09:08 EDT 2005 | pjc
A skilled hand-soldering operator can easily do the rework. Applying liquid flux and raking the iron tip across the leads removes bridges. Removal and replacement of QFP-64 can be done manually. This is of course for very low volume of this type QFP-
Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Thu Sep 13 13:04:52 EDT 2018 | jrs192
Hello! Recently started buying PCBs with peelable mask to remove the need for Kapton tape. Had no issues with our first batch, but our supplier has over-cured the second batch - it comes off in tiny bits, and is stuck in the holes. After timing the
Electronics Forum | Wed Nov 08 20:22:13 EST 2000 | Dave F
You need to remove the oxide before you can properly solder your [or any] component. Call your flux supplier ask them for a more active flux than you are using and for their recommendations on removing the flux residues.
Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John
What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.
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