Electronics Forum: reworks allowed (Page 6 of 18)

Re: Siemens Reliability

Electronics Forum | Tue Mar 09 13:53:21 EST 1999 | Tom B.

We use Siemens equipment at our plant. I agree with what everyone said in the forum. These machines are primarily made for fixed or specfic PCB runs. The feeders are very well built as others have metioned. If you plan on excessive change over's,

Using isopropanol with DI water for rinsing after washing boards

Electronics Forum | Thu Nov 10 10:45:32 EST 2011 | aqueous

The use of IPA in automated defluxing systems is nearly extinct for the following reasons: 1. IPA is flammable. In a spray-in-air environment, the already low flashpoint is even lower. 2. IPA is not a great solvent. There are specific containme

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen

Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t

BGA repair/rework

Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean

| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60

Wet behind the ears

Electronics Forum | Tue May 01 23:06:07 EDT 2001 | djarvis

Mate, I'd love to but we are not allowed to use ENIG (Empaestic Noumenal Ideopraxistical Gunk) here so I really couldn't enter into the debate. Surely people realise that your average SMT boffin is a mental case in a blue coat. I looked up "SMT-engin

Comparison between Glue & solderpaste process

Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo

I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib

Corroded ASIC's

Electronics Forum | Wed Jul 17 03:36:00 EDT 2002 | robbied

Answers are: *Mainly copper and potassium. *it looks like a soft growth. *customer will not accept this, hence the returns. These boards are either reworked or scrapped. *Flux is not an issue. *The cleaning process has been found to be the cause of t


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