Electronics Forum | Fri May 14 14:46:56 EDT 2021 | emeto
Not following the lead paste process window has a whole set of risks for joints quality and reliability.
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Wed Jul 19 20:28:49 EDT 2006 | mrduckmann2000
We recently purchased a Mirtec AOI machine, it take a bit to program but overall we are pleased. The machine has a downward looking camera, we have had some issues with the machine not catching opens. When a IC has it's legs bent straight up off th
Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer
We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use
Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf
Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Electronics Forum | Tue Jan 16 07:51:19 EST 2007 | realchunks
Your Quality Manager won't let you make changes, yet you get blammed for process problems? First, you need a change in management. Second, if you can't change set pre-heat temps, change the conveyor speed. Slow it down and see if your joints loo
Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager
When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
