Electronics Forum | Tue Jul 19 09:18:14 EDT 2011 | davef
Could this be an opportunity to explore the use of cartridge-type paste dispensers? Or maybe a reason to keep working over the weekend. * Re-Storing & Re-Using “Used” Solder Paste. Though not a recommended practice, used solder paste from the stenci
Electronics Forum | Tue Sep 30 15:11:37 EDT 2008 | stimpk
S The tater/potater/potatoe is optional, although I'd rather put mine in the microwave while doing the pot swap so I can eat it afterwards.
Electronics Forum | Wed Oct 01 09:50:48 EDT 2008 | bobsavenger
thanks for the info. I'll see what they want to do. I'm sure that a bag of potatoe's will be the way to go because it's cheap.
Electronics Forum | Thu Nov 22 23:46:27 EST 2018 | jaypark
Some PTHs on a board in the product I am building are not filled enough to meet the IPC-610-F requirement(at least 75% vertical fill) . I have no access to the solder source side due to something installed right beneath it. In order to completely
Electronics Forum | Tue Apr 17 01:45:16 EDT 2007 | Jane
There are several alloys had been using in the industry. For SMT: most people use SAC305 For Wave: most of them use SAC305,SC100C,SCS7,and SACX0307. Of course, different alloy composition have its own recommended profile. There is no such rule tellin
Electronics Forum | Wed Jun 27 11:13:44 EDT 2012 | mosborne1
We are seeing PLCC socket leads not soldered in our SMT process. We are using a KIC thermal profiling device and we are on 50% greem light process window. All other solder joints on the board looks great. The solder flowed what looks like perfect on
Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker
Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i
Electronics Forum | Wed Jun 27 21:53:54 EDT 2012 | davef
Questions are: * When you rework these pads, can you get solder to flow on the pads with a soldering iron? * When you profile the board during reflow, what is the temperature on these pads as compared with other similar pads in the vicinity?
Electronics Forum | Thu Oct 02 03:11:42 EDT 2008 | gsala
Ask FELDER (gmbh), they can replace the alloy (SN100 +Ge+Ni ...) or even with a special kit (FUJI Patent) or if preferred you can transform the solder in the pot w/out replace it in a reliable way. http://www.felder.de/en_produkte.phtml Regards...
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
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