Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL
Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi
Electronics Forum | Wed Sep 20 17:06:23 EDT 2000 | jackofalltrades
On the Vitronics/Soltec Wave Soldering Machines, we have no problems with the hot air knife (called a "Select X De-Bridging Tool" by Vitronics). We have both Delta's and Delta Max's. We have used both air and nitrogen with no problems. When using a "
Electronics Forum | Mon May 14 09:24:36 EDT 2001 | rkevin
Can anyone shed some light on this for me ? Subject: Soldering to Immersion Tin surface finish I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be di
Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Wed Oct 09 16:59:35 EDT 2002 | davef
Russ, as I told Eric the other day ... The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This prov
Electronics Forum | Tue Jan 13 21:00:15 EST 2004 | davef
This sounds like something the saleman of your new Vitronics oven should be happy to help you sort through. ECD [and probably other profiler supplers] provide software for playing with [optimizing?] recipes. In it, they allow you to select from a v
Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef
Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
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