Electronics Forum: serial and number (Page 6 of 27)

tape splicing pros and cons

Electronics Forum | Thu Sep 22 08:06:13 EDT 2005 | gregp

Hello Rob, We have reel hangers on our feeders as opposed to "buckets". The reels cannot be removed while the feeder is mounted to the machine. Thus splicing is not currently an option. As mentioned above, we felt that it is easier to remove the f

Merging BoM and XY Data

Electronics Forum | Fri Feb 22 13:55:27 EST 2019 | bruce_mackean

Is there a need for a simple application to merge a bill of material with the xy placement data into a single (or top/bottom) files for machine programming? ie. add a part number column to the xy data, including "N/A" for parts not found in the BoM?

Coils and Water Soluble Fluxes

Electronics Forum | Wed Oct 10 13:51:08 EDT 2007 | petep

Coilcraft has posted the following and I am wondering how you folks are handling the use of coils in a Water Soluble world. PCB Washing and Coilcraft Parts Coilcraft tests for resistance to solvents per the following specification: Resistance to s

Component Database and Placement List

Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice

For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Lead-Free Finish Boards and Components

Electronics Forum | Wed Jul 07 13:56:57 EDT 2004 | Pierre RICHARD

As converting our boards to lead-free finish (Immersion White Tin) we decided to change de mask color from green to blue. We thought this would be a good idea to spread the idea so we could easily recognize the type of solder application related to t

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 14:50:56 EST 2005 | russ

Rob, Fantastic! I sure wish we would have put our requirements into our last P.O. The G.M of the manufacturer of this machine flat out promised and guranteed a certain CPH after reviewing the products that we would be producing. When the machine w

tape splicing pros and cons

Electronics Forum | Thu Sep 22 13:09:16 EDT 2005 | gregp

Thanks for the reply Rob, This we already do. The machine will pick from the most efficient available feeder (assuming multiples of the same part number)...so when you remove the primary it will seemlessly move to the next available. When you re-in

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste


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