Electronics Forum | Thu May 13 16:59:08 EDT 1999 | KT
Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks
Electronics Forum | Fri May 14 11:24:00 EDT 1999 | Chrys Shea
| Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayland Mas
Electronics Forum | Fri May 14 12:13:55 EDT 1999 | P.L. Sorenson - Technical Consultant
| | Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | | | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayla
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef
It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard
Electronics Forum | Mon Nov 12 19:44:53 EST 2001 | ianchan
Am abit confused here, so suggestion is not to manual rework solder the 0201, and rather to cut em' out, with the cut shear applied at the end-terminals? elaborate pls? thanks
Electronics Forum | Mon May 10 14:40:14 EDT 2004 | hertenstein
I am looking for a industry specification for the amount of strain that is allowable during a parallel blade shearing operation as related to ceramic capacitors. Does anyone know of such a specification? Best regards, Jeff
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Thu Mar 16 10:04:41 EST 2006 | slthomas
"better gasketing, less dog-earing" I suppose gasketing could contribute but my assumption is that it's a function of better shearing action between the blade edge and the aperture wall. You get a more consistent shape on the top of the paste deposi
Electronics Forum | Tue Jan 23 19:27:28 EST 2007 | asir
which characteristics? An alloy with similar melting points, wetting, shear force, reliabilities, etc. Indium has an article about 77.2Sn/20.0In/2.8Ag, but was wondering is there any other out there.
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