Electronics Forum | Wed Apr 25 07:57:36 EDT 2001 | wbu
Steve: Try to find something that�s common to all your skewed parts. We haven�t had much trouble with it except for some MELF diodes a couple of years ago which didn�t look well aligned but made no trouble with specs. Better suited pad design solved
Electronics Forum | Thu Aug 12 14:55:08 EDT 2004 | johnw
Hi guys I havnt been on for a while so its nice to be back been working in europe mostly Fuji CP6 skewing rnets Marcels comment is the closest rnets are a problem as said before the main areas are 1 A good assmbley shape is a must with 30% defaul
Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea
Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all
Electronics Forum | Fri Jun 08 13:29:14 EDT 2001 | dougt
Local fiducials will help component placement but will have no effect on part recognition. Local fiducials help you compensate for board skew or streatch by looking at a small area of the board vs. the board fiducials that cover placement over the e
Electronics Forum | Fri Apr 18 08:24:49 EDT 2003 | tsongshe
Hello,all.these days I met many skewed transistors after reflow soldering.we 've tried many ways attemting solving it thoroughly...changing the aperture pattern,solder volume and even changing the size of pcb pad,but the results are not very good.eve
Electronics Forum | Fri Apr 18 10:28:57 EDT 2003 | davef
Here's how Kevin posted his pix http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=24067
Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas
"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.
Electronics Forum | Wed Apr 23 03:49:13 EDT 2003 | jedduan
I think it will make some progess if you modify the program and let the component shift towards the lead orientation as possible while P&P.
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
