Electronics Forum: smt design (Page 6 of 99)

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

Re: Need to spec in smt prototype equipment

Electronics Forum | Thu May 14 09:01:11 EDT 1998 | Robert Murphy

| Any ideas on what to buy? Only need to build surface mount protos, ability to rework. Is a rework station okay? | Will subcontract production after design is proven.

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.

My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen

Re: Need to spec in smt prototype equipment

Electronics Forum | Tue Jun 23 11:08:42 EDT 1998 | Russ Miculich

| Any ideas on what to buy? Only need to build surface mount protos, ability to rework. Is a rework station okay? | Will subcontract production after design is proven. Best bet is to get an Elite or OK Industries manual printer if you are not doing

Re: Catastrophic failure of solid tantalum smt caps

Electronics Forum | Fri Apr 02 02:01:24 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Has anyone heard of a problem with catastrophic failure of | | | large value (200uF) solid tantulum capacitors that have been | | | exsposed to high humdity. | | | | | I suppose that with water moisture seep in the capacitor, the risk is ver

double sided boards - process / design issue.

Electronics Forum | Tue Sep 22 11:20:08 EDT 1998 | S Maganti

We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along with

Re: double sided boards - process / design issue.

Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys

| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit

i want to know what i need to made a manufacturing line for smt

Electronics Forum | Thu Mar 15 17:33:20 EDT 2007 | Darby

As you are new to this - start with lots of hair and slowly reduce. Start with one good person. Spend the money on someone who knows the process, can set it all up, (including air, power, alignment, calibration, programming, troubleshooting, stenc

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef

pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem

Need help on improving design - Automatic Pick & Place Coil

Electronics Forum | Mon Aug 06 16:33:52 EDT 2018 | tey422

If I understand customer's intention correctly, it would be fastest, mass production with fully utilizing the Pick-N-Place machine capacity with minimum manual labor which won't break the bank. They used to manual hand soldering the coil to the boar


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