Electronics Forum | Thu Apr 17 17:57:13 EDT 2014 | proy
Hello We use a 5 zone conceptronics HVN70 and never before have we had something we could not do including 6 layers Rohs complicated boards. Recently we had a larger - simple 2 layer board - all 1206's etc however there are 15 pcs of a LARGE high m
Electronics Forum | Thu Sep 10 17:10:00 EDT 1998 | Steve Gregory
Hi Tim, 8-mil huh? Boy, that's getting down there...you know, placing 8-mil is one thing, but printing solder paste on 8-mil pitch is another. Most of the time when I've seen 8-mil pitch on a board it's been attached with hot-bar...but I guess
Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F
Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting
Electronics Forum | Mon Sep 27 11:40:50 EDT 2004 | grayman
use water soluble solder paste is the cure for your problem. but if you insist of using NC change your pogo pins to pointed pins.
Electronics Forum | Thu May 24 19:19:20 EDT 2001 | davef
Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4
Electronics Forum | Sun Mar 15 08:48:53 EDT 2015 | davef
Sure, the formulation and purpose of a soldering flux and a socket cleaner are basically the same. Off the top of my head, differences are: * Activation temperature: soldering flux [~200*C], socket cleaner [~120*F] * Compatibility with some solder
Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Sat Nov 19 03:15:39 EST 2016 | sarason
Does the file come off of an ICT. Next question is it an AGinet/HP/Keysight 3070. If so you have a chance at finding out the format. It is probably posted online in the Keysight manual downloads section. I might still have an old paper copy of this
Electronics Forum | Wed May 30 22:13:45 EDT 2012 | davef
Richard Lathrop, technical service manager, SMT materials, Heraeus Circuit Materials Division, may be contacted at (610) 825-6050, ext. 265; e-mail: rlathrop@4cmd.com.
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