Electronics Forum: soak (Page 6 of 57)

FAST but safe QFP Rework station profile for REMOVAL ONLY

Electronics Forum | Tue Apr 07 09:02:00 EDT 2020 | proy

I am removing a few QFP100s with a Pace rework station. Most of my profiles stored are set up with preheat/soak/spike which is more geared to the replacement resoldering. I am looking for suggestions on what people use for a quick/safe removal ie: no

Vapour Phase Reflow Profiling (Would like to understand more on how to determine a PCB's Profile/Recipe)

Electronics Forum | Mon Jun 27 14:44:47 EDT 2022 | kelvinchoong

Hi Sir, The VP Machine that i am currently using takes reference from its own temperature sensor. so most of the time i would have to adjust multiple times for my PCB to soak at the right temperature or reflow for the duration that i need it to. Fo

Selective Solder Nozzle Life

Electronics Forum | Mon May 15 18:31:28 EDT 2023 | daniel_stanphill

I have found Superior No. 75 to be an absolute miracle worker when it comes to nozzle maintenance. I let our worst nozzles soak in that over the weekend and then the majority of the dross would literally flake off with light pressure from a pick/scre

Re: BGA faults

Electronics Forum | Thu Aug 17 07:48:46 EDT 2000 | Kamran.T

Sounds like improper heat distribution! Raise your prheat/soak time to assure even heating of the board∂. Another issue could be the moisture causing this anomaly.

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Sun Nov 07 11:15:57 EST 1999 | Steve Thomas

And you still have sufficient volume left when you do that? I'm new to this, so I'm not questioning the validity of your statement, just soaking up what I can.....thanks. Steve

Reflow Specs.

Electronics Forum | Tue Aug 14 21:29:29 EDT 2001 | mugen

Hi, Just to clarify the terms, traditional : aka : Ramp-Soak-Spike (RSS) profiling method tent : aka : Ramp-To-Spike (RTS) profiling method By search engines (eg. Yahoo), you can find more example profiles for your ref.

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Thu Aug 23 00:17:53 EDT 2001 | mugen

Mike, 1) NC process = less BGA voids & void-size 2) longer soak times... Heyz, thanks mate :) ~~~~~~~~~~~~~~ Dave F, tot u were inclinded to the school of thought, that NC process hath higher chance for whining abt voids?

Cleaning SMD Adhesives

Electronics Forum | Wed Oct 23 03:48:48 EDT 2002 | kcngoi

Hi , DEK S'pore came out with a univeral frame called 'vector',that the stencil can be removed from the frame and soak into solvent for effective cleaning. RGDS JOSEPH

Epoxied Parts Falling Off

Electronics Forum | Wed Feb 26 10:57:47 EST 2003 | larryk

Dave, I had to contact Circuits Assembly, but I got the article. I'm going to forward it on to Ryan. I think you're on to his problem with flux becoming entrapped in the epoxy. It plays along with Locktites suggestion of a longer soak on his profile.

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto

Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If


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