Electronics Forum: soaking (Page 6 of 57)

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter

Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold

Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.

Re: BGA faults

Electronics Forum | Thu Aug 17 07:48:46 EDT 2000 | Kamran.T

Sounds like improper heat distribution! Raise your prheat/soak time to assure even heating of the board∂. Another issue could be the moisture causing this anomaly.

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Sun Nov 07 11:15:57 EST 1999 | Steve Thomas

And you still have sufficient volume left when you do that? I'm new to this, so I'm not questioning the validity of your statement, just soaking up what I can.....thanks. Steve

Reflow Specs.

Electronics Forum | Tue Aug 14 21:29:29 EDT 2001 | mugen

Hi, Just to clarify the terms, traditional : aka : Ramp-Soak-Spike (RSS) profiling method tent : aka : Ramp-To-Spike (RTS) profiling method By search engines (eg. Yahoo), you can find more example profiles for your ref.

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Thu Aug 23 00:17:53 EDT 2001 | mugen

Mike, 1) NC process = less BGA voids & void-size 2) longer soak times... Heyz, thanks mate :) ~~~~~~~~~~~~~~ Dave F, tot u were inclinded to the school of thought, that NC process hath higher chance for whining abt voids?

Cleaning SMD Adhesives

Electronics Forum | Wed Oct 23 03:48:48 EDT 2002 | kcngoi

Hi , DEK S'pore came out with a univeral frame called 'vector',that the stencil can be removed from the frame and soak into solvent for effective cleaning. RGDS JOSEPH

Epoxied Parts Falling Off

Electronics Forum | Wed Feb 26 10:57:47 EST 2003 | larryk

Dave, I had to contact Circuits Assembly, but I got the article. I'm going to forward it on to Ryan. I think you're on to his problem with flux becoming entrapped in the epoxy. It plays along with Locktites suggestion of a longer soak on his profile.

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto

Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 18:01:20 EST 2004 | davef

Rethinking to Ramp / Soak: Yano, staying with ramp might not be all that bad after all, just decrease the ramp / slow-down the conveyor.


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