Electronics Forum | Mon Feb 02 17:52:11 EST 2004 | swagner
We are not having a problem, we have a customer that would like us to use post reflow AOI to inspect the solder joints to class three. I would like to see if anyone is having sucess doing this.
Electronics Forum | Wed Nov 26 11:19:58 EST 2008 | vladig
I don't think you can find any specs on that. As long as a solder joint can not be broken by virtually "blowing over it" any reading on the UTS, or shear strength can be very confusing. You can specify, though that the assembly (joint) should withsta
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Thu Jun 01 21:59:10 EDT 2000 | Ray Chartrand
Does anyone know the current cost to repair a defective solder joint? I seem to recall a number quoted a few years ago of $1.03 per joint with burden of overhead. I've also seen numbers from 50 cents to 50 dollars per joint.
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Fri Sep 29 15:41:02 EDT 2000 | Dave F
It's easy to reject everything is it? IPC offers excellent training courses for inspectors in interpreting A-610.
Electronics Forum | Wed May 28 11:56:18 EDT 2003 | blnorman
Yes we are using "silicones", but to find this contaminant we were looking for "silicon" the element by SEM/EDS. We use Dow materials and my contact there is checking to see if they have any info.
Electronics Forum | Tue Feb 03 12:24:56 EST 2004 | swagner
Paul, do you have any kind of false failure data for the application you struggled with? Also what amount of manpower did you use to operate the system(s).
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
