Electronics Forum | Wed Jul 07 13:56:57 EDT 2004 | Pierre RICHARD
As converting our boards to lead-free finish (Immersion White Tin) we decided to change de mask color from green to blue. We thought this would be a good idea to spread the idea so we could easily recognize the type of solder application related to t
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Wed Nov 23 09:38:52 EST 2011 | blnorman
More agreement with screen print adhesives. Back in a former life time we did do pin transfer on one of our product lines. If you had to go with pins, make sure your adhesive rheology is suited for it. Different adhesives are designed for specific
Electronics Forum | Wed Nov 23 07:30:44 EST 2011 | scottp
Are you stuck with pin transfer for some reason? Screen printing is more repeatable and easier to maintain.
Electronics Forum | Mon Jul 29 09:19:00 EDT 2002 | pjc
Quick Change Tooling is one advantage for DEK when comparing the MPM UP2000. DEK has Form Flex. Good system, but I've heard concerns about long term dependabilty. All support tooling options offered on the UP2000 takes a bit of time to set up. So, If
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Thu Oct 16 10:17:51 EDT 2008 | kevslatvin
I'd start by looking at the available tips from the manufacturer of the iron you are using. They usually have a selection of specialty tips in their catalog either online or in print.
