Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Fri May 26 16:24:45 EDT 2006 | Jak
Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due
Electronics Forum | Fri Sep 26 07:27:29 EDT 2008 | realchunks
This sounds interesting. Could you explain?
Electronics Forum | Mon Oct 19 15:08:14 EDT 2009 | markhoch
Would be glad to offer some assistance, but I've got a couple of questions first: 1) What type of supplemental flux are you using? (If any) 2) Is your problem consistent across all assemblers, or can you trace the assemblies with solder ball issues b
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Mon Sep 22 15:21:19 EDT 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives for postings like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30878
Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
