Electronics Forum | Mon Aug 02 11:47:35 EDT 1999 | Mike Lare
Just wanted to thank everyone for your inputs. This info will at least give me a decent starting point.
Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Fri Jul 30 15:41:16 EDT 1999 | M.L
| | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly a
Electronics Forum | Fri Jul 30 15:22:52 EDT 1999 | M.L
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms
Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Wed Mar 07 08:37:29 EST 2007 | davef
First, don't put solder paste in a wave solder pot, the 50% by volume of organics and volatiles will gas off in an astonishing amount of fume, leaving a dismaying mess of spent resin and molten plastic in your pot. Second, when you say, "Paste that
Electronics Forum | Mon Mar 05 12:52:06 EST 2007 | DC
Any one have experience of MyData paste jet printing? I don't ave chance to take a look at Apex but it can reduce the paste, no stencil required and paste volume control by programming.
Electronics Forum | Tue Feb 10 17:38:22 EST 2015 | mbartel
low volume high mix, looking for advice on what i should get, a stencil machine or a jet printer for smt solder paste. used/new and companies i should look into?
