Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
Electronics Forum | Mon Nov 06 14:00:45 EST 2006 | nodlac
Checks calendar ...nope not April 1st. -The fresher the paste the better the solder joint. Agreed - My dilema here is upper management wants the two lines to share one stencil printer thus saving the cost of purchasing a second printer. They propos
Electronics Forum | Fri Oct 29 15:43:43 EDT 2004 | glaucon
Forgot details: Use a sample product that you will be running in production. Let each Equipment vendor run a test to meet your requirements. Often with each of these machines (MPM/DEK/EKRA) the key machine features are: -2D Inspection (for minimiz
Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker
You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon
| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach
Electronics Forum | Mon Aug 21 19:38:33 EDT 2000 | Dave F
Eric: I�ll pass on the uV and ammonia, also. Thoughts are: 1 You�re correct that the temperature/humidity mix can be a big driver to latex peelable solder mask cure time, but don�t overlook material thickness. Dispensers put material in a very th
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu Jul 25 12:25:54 EDT 2019 | davef
In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said: What change constitutes a need for requalification? Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, so
