Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Tue Jul 28 07:07:00 EDT 1998 | John Godfrey
I need to remove all flux splatters from our boards. We've adjusted the oven profiles with the production paste, but have not been able to eliminate the splatter. I've tested sample from several paste suppliers and have only been able to find 1 which
Electronics Forum | Wed Aug 23 08:50:04 EDT 2000 | Dave F
Dr. Lee: We had a discussion on the forum recently and I wanted to get your input. What is the best method(s) for elimating (reducing) no-clean solder paste flux from splattering on gold interconnect fingers on a PCA?
Electronics Forum | Tue Jan 30 12:58:49 EST 2007 | barryg
We are seeing problems with platinum over silver plated part also. Our main problem is solder splatter under these devices, and voiding at the terminations on parts off the reels.I am curious if you have removed any of these parts and noticed any spl
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Thu Aug 12 14:55:08 EDT 2004 | johnw
Hi guys I havnt been on for a while so its nice to be back been working in europe mostly Fuji CP6 skewing rnets Marcels comment is the closest rnets are a problem as said before the main areas are 1 A good assmbley shape is a must with 30% defaul
Electronics Forum | Sat Feb 05 23:54:37 EST 2005 | sms_don
Hello, I found the previous discussion of lead free profiles on 5 zone ovens very interesting. I had the same concerns, but have recently succeeded in creating profiles on a 5 Zone QUAD oven that have eliminated solder splatter or Solder on Gold w
Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN
so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do
Electronics Forum | Thu Jun 09 03:16:06 EDT 2005 | PSGill
I'm using Kester R520A Lead free solder paste. The flux % stated on the Certificate of Analysis(COA) when the product delivered to us is 10 %. The tolerance is 1%. But when i send the jar to an external lab to determine the flux % it is more than 11%
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
