Electronics Forum: solder volume (Page 6 of 115)

Seeking very low volume production reflow oven

Electronics Forum | Mon May 01 23:23:58 EDT 2006 | grantp

Hi, I off center idea we used when we started. Get a pasta cooker, and put in vapor phase fluid, and then use that. Place the product in the bottom of the inner pot, and then heat on a small hot plate. When the vapor cloud gets high enough and the

Seeking very low volume production reflow oven

Electronics Forum | Thu Apr 27 11:50:21 EDT 2006 | samir

90% of the battle with thermal profiling is your thermocouple attachment. That is Process Engineering 101. It's just like painting your house. The masking and prep work will make or break the end result. KIC did a DoE on which thermocouple attach

Low volume quality PCBs (how to)

Electronics Forum | Thu Jul 14 19:12:40 EDT 2005 | sync40

Hi. In the past years I had made dozens of PCBs but now I am trying to get a professional finishing on them. The main problem is oxidation of the copper traces. Basically I use the silkscreen method to make the pattern in both layers and then etch. L

Seeking very low volume production reflow oven

Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC

I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur

The specification of Paste deposition thickness and volume

Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai

Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Dima's Pick and Place Machines and other low volume P&P

Electronics Forum | Thu Apr 26 12:06:08 EDT 2007 | basem

$100K for this entire line. We are thinking of getting a Chinese made reflow oven that looks pretty good at $25K. Also, we need to deposit solder using a dispenser as stencil printing will be reserved only for higher volume boards. It will not be pra

Need help on selecting the SMT equipment for small volume

Electronics Forum | Thu Jul 14 17:18:38 EDT 2005 | August

Dear All, I'm looking for the complete SMT equiment line (solder printer, P&P, Reflow) uses for the small volume production line. I happen to know that Manncorp and APSGold can provide the complete ST line, but I haven't hear and use these machine be

Need help on selecting the SMT equipment for small volume

Electronics Forum | Wed Jul 20 12:48:50 EDT 2005 | danhui888

Dear All, I'm looking for the complete SMT > equiment line (solder printer, P&P, Reflow) uses > for the small volume production line. I happen to > know that Manncorp and APSGold can provide the > complete ST line, but I haven't hear and use > t

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F

Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�


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