Electronics Forum | Tue Apr 24 11:48:06 EDT 2001 | relensky
Thank you for the input
Electronics Forum | Tue Feb 24 16:44:55 EST 2009 | ldavis
Yes, we are only running no-clean pastes.
Electronics Forum | Tue Jan 06 19:53:32 EST 2004 | jj
Hi, Any idea what's the possible causes of cold solder after drop test? Thanks JJ
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Mon Feb 23 17:51:55 EST 2009 | ldavis
Chet, We've found the exact opposite. Boards we process in VP are cleaner than convection. Sorry but I cannot provide any meaningful data to back that up though. We conduct SIR testing internally using our high impedance pcba's.
Electronics Forum | Mon Feb 23 17:57:16 EST 2009 | cgodbole
Hi Larry, thanks for quick response. Do you have such observation for No clean paste process also? regards chet
Electronics Forum | Mon Apr 23 14:02:26 EDT 2001 | relensky
I am looking for a repeatble method to determine the quality of solder wetting to a PCB. I would like something that I can perform in-house, at low cost, with reliable results. My goal is to test the wetting on white-tin PCB's, after repeated reflo
Electronics Forum | Mon Feb 23 14:44:08 EST 2009 | sunny
Are boards produced using Vapor phase ovens dirtier than N2 Reflow oven. Are there any studies/papers someone can point to? if not what are the methods to verify this? is IPC specified SIR test using 24B SIR test coupons? please advise. thanks in adv
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.