Electronics Forum | Thu Dec 23 03:53:15 EST 1999 | Wolfgang Busko
I thought it might be something from baseball but I must admit that my concentration watching this game was more on the outfield action and on trying to understand the rules. And besides, couple of years passed since my stay in US. Yeah at first sig
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Thu Feb 18 08:35:10 EST 1999 | Dave F
| We have problems with solder balls after reflow. Anybody have any ideas as to what causes them? | Al: Tuffty's comments are good, but point to the broader problem in trying to make recommendations on your problem ... There's just not enough info
Electronics Forum | Mon Aug 27 22:48:21 EDT 2001 | dougk
Used an older model of the one you described. Have used Asymtech and Fuji's as well. The Camalot is accurate, reliable, and easy to program. The only things I disliked about it was that is was slower than the fuji's, and if the pressures weren't set
Electronics Forum | Tue Sep 04 11:09:25 EDT 2001 | blnorman
As the others have stated, moisture is the killer. You have to be sure no moisture is allowed to get to the paste. If it does, you'll get solderballs. I would suggest not using a vacuum. The solvents and other volatile components of the flux will
Electronics Forum | Mon Oct 01 03:46:57 EDT 2001 | wbu
Have never heard of solderballs during rework using solder wire. Noticed the tendency to have little balls of flux with too hot iron and lots of solder used for shields or massive cables to be connected. Seems to me a question of believe if it does
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
Electronics Forum | Thu Aug 01 08:31:51 EDT 2002 | patrickbruneel
Christopher, It looks like you might be close to the solution for your problem because you mentioned that you can make the solderballing worse with lowering the preheat temp. This means that the preheating has a significant impact. I would suggest t
Electronics Forum | Fri Apr 23 11:42:30 EDT 2004 | patrickbruneel
Thanks for the answer. what i believe happent is that the manufacturer of the paste reduced the tackiness of the paste to eliminate the squeegee sticking problem, and now with the reduced tack its a lot easier for the powder particles to break off du
Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ
This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short
